September 21, 2021
TE Connectivity (TE), a world leader in connectivity and sensors, introduces its Mezalok High-Speed Low-Force (HSLF) XMC connector to support data rate speeds up to 32+ Gb/s for improved signal processing on embedded computing applications. The enhanced HSLF Mezalok connector joins TE’s family of rugged, highly reliable connectors designed to meet the growing demand for higher data rates. Designed specifically for mezzanine applications, the connector meets legacy Mezalok high speed connector qualifications and uses a rugged dual point contact system.
Fast, refined, rugged, upgradeable and flexible, Mezalok HSLF XMC connectors meet the same rugged standards as VITA 47 and VITA 72. Suited best for aerospace, ground vehicle, marine and missile defense applications, these HSLF connectors feature a wide operating temperature range and excellent thermal stability with VITA 42.3 pinout.
“Technology changes rapidly and it’s always important for us to quickly adapt and solve for market needs. We know signal integrity strength is crucial for reliable high-speed signal transfer within the environments this type of connector is used,” said Jason Dorwart, product manager for TE’s Aerospace, Defense and Marine division. “We also designed this particular connector to be easier to remove from the board and are truly excited to continue on with our Mezalok connector legacy by introducing our low-force product offering.”
The highly reliable Mezalok HSLF uses the reliable ball grid array printed circuit board surface mount. The 114-position connector is compliant to VITA 61 standards and additional positions and stack heights are available.
TE’s Mezalok HSLF connector family offers:
-Unmating force reduction of 47%
-Mating force reduction of 32%
-Rugged dual-point contact system
For product configurations, TE features:
-Multiple positions – 60, 114 and 320
-Multiple stack heights – 10,12,17 and 18 mm
-Ball grid array PCB supports standard surface mount processing