Balluff Wafer Mapping Sensor Delivers Precision in the Smallest Spaces
Balluff’s new wafer mapping sensor, BOH00EZ, utilizes a highly precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods. Especially designed for use with extremely thin end effectors, it features an extremely controlled and focused light spot, allowing it to detect wafers even just a few μm thick with extreme precision.

